1. Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 165W

2. Intel® C622 chipset

3. Up to 768GB ECC 3DS LRDIMM, up to DDR4-2666MHz; 6x DIMM slots

4. Expansion slots: 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (in x8)

5. 2 10G SFP+

6. 12 SATA3 (6Gbps) via C622

7. Supports 12V DC power input

8. 4-pin Internal power connector

9. 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)

10. I/O: 1 VGA, 2 COM, TPM header