1. Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 205W

2. Intel® C622 chipset

3. Up to 768GB ECC 3DS LRDIMM, up to DDR4-2666MHz; 6x DIMM slots

4. Expansion slots:
1 PCI-E 3.0 x8 (in x16), 1 PCI-E 3.0 x32 Left Riser slot

5. 4 SAS3 (12Gbps) via Broadcom 3008; RAID 0, 1, 10

6. 2 10GbE LAN ports

7. 10 SATA3 (6Gbps) via C622

8. I/O: 1 VGA, 2 COM, TPM header

9. 2 SuperDOM with built-in power

10. M.2 NGFF connector