1.
Intel® Xeon® Scalable
Processors, Single Socket P (LGA 3647) supported, CPU TDP support 205W
2.
Intel® C622 chipset
3.
Up to 768GB ECC 3DS
LRDIMM, up to DDR4-2666MHz; 6x DIMM slots
4.
Expansion slots:
1 PCI-E 3.0 x8 (in x16), 1 PCI-E 3.0 x32 Left Riser slot
5.
4 SAS3 (12Gbps) via
Broadcom 3008; RAID 0, 1, 10
6.
2 10GbE LAN ports
7.
10 SATA3 (6Gbps) via
C622
8.
I/O: 1 VGA, 2 COM, TPM
header
9.
2 SuperDOM with built-in
power
10.
M.2 NGFF connector
