1. Intel® Xeon® Scalable Processors, Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s, CPU1: Skylake-F CPU supported, CPU2: Skylake-F CPU supported

2. Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots

3. 6 PCI-E 3.0 x16,
1 PCI-E 3.0 x4 (in x8 slot)
M.2 Interface: PCI-E 3.0 x4
M.2 Form Factor: 22110

4. Intel® C621 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10

5. Dual LAN with Intel® X550 10GBase-T Ethernet Controller

6. Integrated IPMI 2.0 and KVM with Dedicated LAN

7. 5 USB 3.0 ports, 4 USB 2.0 ports

8. HD Audio with optical S/PDIF