1.
Intel® Xeon® Scalable
Processors, Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up
to 10.4 GT/s, CPU1: Skylake-F CPU supported, CPU2: Skylake-F CPU supported
2.
Up to 2TB 3DS ECC RDIMM,
DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
3.
6 PCI-E 3.0 x16,
1 PCI-E 3.0 x4 (in x8 slot)
M.2 Interface: PCI-E 3.0 x4
M.2 Form Factor: 22110
4.
Intel® C621 controller
for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
5.
Dual LAN with Intel® X550
10GBase-T Ethernet Controller
6.
Integrated IPMI 2.0 and
KVM with Dedicated LAN
7.
5 USB 3.0 ports, 4 USB
2.0 ports
8.
HD Audio with optical
S/PDIF
