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Product SKUs
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MBD-X11DPi-NT
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X11DPi-NT
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Physical Stats
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Form Factor
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E-ATX
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Dimensions
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12" x
13" (30.48cm x 33.02cm)
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Processor/Cache
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CPU
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Intel®
Xeon® Scalable Processors.
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Dual Socket
P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s
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CPU1:
Skylake-F CPU supported
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Cores / Cache
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Up to 28
cores
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System Memory
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Memory Capacity
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Up to 2TB
3DS ECC RDIMM and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
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Memory Type
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2666/2400/2133MHz
ECC DDR4 RDIMM, LRDIMM
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DIMM Sizes
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RDIMM: 64GB
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LRDIMM:
64GB
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3DS LRDIMM:
128GB
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Memory Voltage
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1.2V
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Error Detection
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Corrects
single-bit errors
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Detects
double-bit errors (using ECC memory)
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On-Board Devices
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Chipset
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Intel® C622
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SATA
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Intel® C622
controller for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
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IPMI
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ASPEED
AST2500
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Network Controllers
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Dual LAN
with 10GBase-T with Intel® X722 + X557
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Graphics
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Aspeed
AST2500 BMC
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Input / Output
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SATA
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14 SATA3
(6Gbps) port
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LAN
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RJ45 Shared
IPMI LAN port
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USB
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4 USB 2.0
ports (2 rear + 2 headers),
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5 USB 3.0
ports (2 rear + 2 headers + 1 Type A)
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Video Output
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1 VGA port
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Serial Port / Header
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2 COM Ports
(1 rear, 1 header)
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TPM
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1 TPM
Header
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Expansion Slots
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PCI-E
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4 PCI-E 3.0
x16,
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2 PCI-E 3.0
x8
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M.2
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M.2
Interface: PCI-E 3.0 x4
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Form
Factor: 2260, 2280, 22110
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System BIOS
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BIOS Type
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AMI UEFI
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Management
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Software
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Intel® Node
Manager, IPMI2.0, KVM with dedicated LAN, SPM, SSM, SUM, SuperDoctor® 5,
Watchdog
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PC Health Monitoring
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Voltage
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+1.8V,
+12V, +3.3V, +5V, +5V standby
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FAN
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8x 4-pin
fan headers (up to 8 fans), Pulse Width Modulated (PWM) fan connectors, PWM
fan speed control
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Temperature
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N/A
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LED
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N/A
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Other Features
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Chassis
intrusion detection, CPU thermal trip support for processor protection,
Node Manager Support, RoHS
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Operating
Environment
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Operating Temperature Range
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0°C ~ 50°C
(32°F ~ 122°F)
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Non-Operating Temperature Range
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-20°C ~
60°C (-4°F ~ 140°F)
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Operating Relative Humidity
Range
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10% ~ 85%
(non-condensing)
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Non-Operating Relative Humidity
Range
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10% ~ 95%
(non-condensing)
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Key Features
1.
Intel® Xeon® Scalable
Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up
to 10.4 GT/s, CPU1: Skylake-F CPU supported
2.
Intel® C622
3.
Up to 2TB 3DS ECC RDIMM
and DDR4-2666MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
4.
4 PCI-E 3.0 x16,
2 PCI-E 3.0 x8
M.2 Interface: PCI-E 3.0 x4
M.2 Form Factor: 2260, 2280, 22110,
2 PCI-E 3.0 NVMExpress x4 Internal Port(s)
5.
1 VGA port
6.
Intel® C622 controller
for 14 SATA3 (6 Gbps) ports; RAID 0,1,5,10
7.
Dual LAN with 10GBase-T
with Intel® X722 + X557
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