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Key Features
- Intel Xeon Scalable Processors, Single Socket P (LGA 3647)
supported, CPU TDP support 205W
- Intel C622 chipset
- Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8x DIMM slots
- Expansion slots:
- 1 PCI-E 3.0 x16 (x16 || x8),
- 1 PCI-E 3.0 x8 (x0 || x8),
- 1 PCI-E 3.0 x8,
- 1 PCI-E 3.0 x4 (in x8)
- 2 10G SFP+
- 10 SATA3 (6Gbps) via C622
- 8 SAS3 (12Gbps) via Broadcom 3008; RAID 0, 1, 10
- 2x Port NVMe PCI-E 3.0 x4 via OCuLink
- 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2
rear, 6 via headers)
- I/O: 1 VGA, 2 COM, TPM header
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